全新进口TRI 3D在线AOI和离线AOI SMT全自动检测设备 TR7700Q TR7710 TR7700QE

r TR7700Q 3D AOI 拥有数位四向条纹光投影技术，结合新颖的2D+3D 检测技术，为组装电路板检测领域掀起全新技术。全方位3D数位条纹光技术涵盖检测范围广阔，拥有JJ的J准性呈现极小共面缺陷及焊点问题。 TRI的3D锡点及爬锡检测符合IPC标准，确保爬锡的品质。藉由检查爬锡高度及体积，TR7700Q 3D AOI可检测出少锡、缺锡、空焊等不良现象。 r

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rr ? 超高精度 2D+3D AOI 走停式取像
r? 爬锡高度及体积检测功能rrr ? 清晰且可靠的3D四光源数位条纹光rrr ? 可变频3D检测范围高度高达 30 mmrrr ? 免空压智能化自动运输送带系统(IACS)rr

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r Optical System r

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r Imaging Method r	r Stop-and-Go Imagingr
r Top Camera r	r 4 Mpix or 12 Mpix (factory setting)r
r Angle Camera r	r N/Ar
r Imaging Resolution r	r 5.5 μm, 10 μm, 15 μm (factory setting)r
r Lighting r	r Multi-phase True Color LEDr
r 3D Technology r	r Quad Digital Fringe Projectorsr
r Max. 3D Range r	r 4 Mpix@ 15 μm: 0-30 mm* r12 Mpix@ 5.5 μm: 0-4 mm r12 Mpix@ 10 μm: 0-30 mm* r*Need GPU card upgrader

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r Inspection Performance  r

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r Imaging Speed r

r 4 Mpix@ 15 μm: 21 cm2/sec r12 Mpix@ 10 μm: 14.5 cm2/sec  r12 Mpix@ 10 μm: 23 cm2/sec with optional CoaXPress rNote: Depending on component distributionr

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r Motion Table & Control r

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r X-Axis Control r	r Ballscrew + AC-servo controllerr
r Y-Axis Control r	r Ballscrew + AC-servo controllerr
r Z-Axis Control r	r Ballscrew + AC-servo controllerr
r X-Y Axis Resolution r	r 1 μm with linear encoderr

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r Board Handling r

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r Max PCB Size r	r TR7700QI @ 5.5 μm: 330 x 330 mm* rTR7700QI @ 10 μm, 15 μm: 510 x 460 mm  rTR7700QI DL @ 10 μm, 15 μm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane r*Depending on component distribution, the vailable PCB size could be differentr
r PCB Thickness r	r 0.6-5 mmr
r Max PCB Weight r	r 3 kgr
r Top Clearance r	r 5.5 μm: 25 mm r10 μm: 50 mm r15 μm: 40 mmr
r Bottom Clearance r	r 40 mm [100 mm optional]r
r Edge Clearance r	r 3 mm [5 mm optional]r
r Conveyor r	r Inline rHeight: 880 – 920 mm r* SMEMA Compatible r

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r Inspection Functions r

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r Component r	r Missing rTombstoning rBillboarding rPolarity rRotation rShift rWrong Marking (OCV) rDefective rUpside Down rExtra Component rForeign Material rLifted Component r
r Solder r	r Solder Fillet Height rSolder Volume % rExcess Solder rInsufficient Solder rBridging rThrough-hole Pins rLifted Lead rGolden Finger rScratch/Contamination r

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r Dimensions r

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r WxDxH r	r TR7700Q: 1000 x 1400 x 1650 mm rTR7700Q DL: 1000 x 15000 x 1650 mm rNote: not including signal tower, signal tower height 520 mmr
r Weight r	r TR7700Q: 650 kg rTR7700Q DL: 685 kgr

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